Ihhavini Lomoya Oshisayo Eliphindwe kabili
Ukomiswa kokuphrinta kwe-PCB okukodwa/okukabili, Ukuphrinta I-Legend kuma-Multi-Layer Plates, Ngaphambi Kokubhakwa Kwemaski Ye-Solder, Ukubhaka Kwangaphambili Kokuxhuma, Uyinki, I-HASL.
1, Yamukela uhlelo lokushisa lobunikazi, ukonga amandla 30%
2, Yamukela ifeni ejikelezayo enesivinini esikhulu, efakwe isondo lomoya elinelungelo lobunikazi ukuthutha umoya
3, Yamukela uhlelo lokulawula ikhompyutha yezimboni
4,Sebenzisa isihlungi esingenisiwe esisezingeni eliphakeme sezinga eliyi-100 ukuhlunga umoya ojikelezayo
5, Ngamasethi angu-2 ezinkomba zezinga lokushisa elingaphezulu kanye nomsebenzi we-alamu
6,Ibhokisi elingaphakathi lenziwe ngepuleti lensimbi engagqwali elingu-1.0mm, kanti ibhokisi langaphandle lenziwe ngepuleti lensimbi elingu-1.2mm elingu-A3;
7, Insulation impahla: 100K friendly ukotini high-temperature kuyasetshenziswa, futhi ukujiya ukwahlukanisa 100mm;
8, Ukuvalwa konqenqema lomnyango: Kuvalwe ngokuqinile ngejeli ye-silica ekwazi ukumelana nokushisa okuphezulu.
9, Yamukela ukwenza ngokwezifiso kwamakhasimende.
I-PLC:I-MITSUBISHI
Imoto:I-Taiwan
Isimo esiqinile:I-AUTONICS
Isikrini sokuthinta:weinview
Ukuxhumana:I-MITSUBISHI
I-Thermostat:I-RKC
Ubukhulu bosayizi wokucubungula:630mm×730mm
Usayizi omncane wokucubungula:350mm×400mm
Ibanga lokuqina kwebhodi:0.02-4.0mm
Ukufana kwezinga lokushisa:±2℃
Usayizi wehhavini:kungenziwa egcizelele ngokuvumelana nezidingo
Indlela yokubhaka:umoya oshisayo ojikeleza ngesivinini esikhulu
Ukukhetha umsebenzi:ingahlukaniswa ngezinketho zokubhaka zesiteji esisodwa/eziningi
Ibanga lokushisa:izinga lokushisa elivamile -220 ℃
Ivolumu yomoya yokukhipha:6-8m/s
